A fully automated high-tech factory for semiconductors is coming into being at the company's site in Villach, Carinthia. In addition to existing production operations, a fully automated chip plant is being built to produce 300mm diameter thin wafers at a cost to Infineon of EUR 1.6 billion. At the end of 2021, the new chip production plant with 60,000 m2 of building space is scheduled to be completed. Moreover, a new research and development building for a staff of 350 people is also emerging. The new research hub will already commence operations in the spring of 2020.
The Villach facility serves as the competence centre for power semiconductors of the Infineon Group, and has long been an important innovation location in Infineon's production network. Here the production of power semiconductors on 300mm diameter thin wafers was developed, which was subsequently expanded at the Dresden plant in recent years within the context of fully automated, high volume manufacturing. Due to the large diameter of the chip, the application of this technology leads to considerable advantages with respect to productivity and reduces the capital employed.
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